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Laser processing of thin brittle non-metallic materials.

Superwave Laser Technology Co.,Ltd | Updated: Mar 16, 2018



As an advanced processing tool, laser has been playing an important role in industrial production. With the continuous development of laser technology itself, depending on its complexity in machining quality, machining, machining efficiency and clean environmental protection advantage, not only in stainless steel, copper, alloy, etc all kinds of metal materials processing in favour, and also is glass, ceramic, sapphire, semiconductor silicon wafers, PCB board and other various kinds of non-metallic materials processing highlights the unique advantages.


The processing challenge of thin brittle material.
In the nonmetal processing field, the laser processing of thin brittle materials is of great concern. As smartphones, LED lighting, tablets, as well as the continuous development of wearable devices such as consumer electronics, material such as glass, sapphire, and ceramics, relying on its own won a wide application due to the lack of unique high quality attributes, such as hard toughened glass used in intelligent mobile phone screen; Hard and chemically stable ceramics are used to make electronic component substrate and insulating materials; The hard and resistant sapphire is used for LED substrate, mobile phone camera to protect glass, smart phone display screen, smart watch cover glass, etc.


The glass, sapphire, or ceramic materials used in these applications are usually thinner, harder and more brittle. And on the processing requirements, the application usually needs to be implemented on these fragile material very precision cutting, drilling and slotting machining process, which makes the traditional milling, drilling, grinding and other mechanical processing technology is facing great challenge, because the material very thin brittle, due to contact in the manufacturing process of any stress applied to materials, can lead to material fracture, eventually scrapped.


However, the challenges faced by traditional machining methods bring more opportunities for non-contact laser processing.