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Introduction of laser marking method

Superwave Laser Technology Co.,Ltd | Updated: Jan 17, 2018



The new application of optical fiber laser marking machine, as people attach importance to the control of product liability law (Pl) and ISO product standard quality, requires the quality control to have the ability to track manufacturing process and process. As a means of accurately tracking quality information, its demand is expanding. In addition, with the mature and development of laser marking technology, laser marking has opened up many new methods and applications in recent years.

 

1 shallow ditch marking. Shallow groove marking is the formation of shallow furrow marks on the surface of materials. Marking too deep can cause damage to the surface of the material. For example, the marking depth of IC packaging shell must be controlled within a few microns. Laser marking method is usually used to replace the engraving machine and seal machine.

 

2 deep groove marking. Deep groove marking refers to the formation of deep marks on the surface of the material, mainly for the processing of metal materials. A deep groove is usually formed by using a laser to melt, vaporize or repeatedly scan the surface of the material. This method can replace the conventional etching process.

 

3. Black (oxidation) marking. Black marking is the mark that oxidizes the material surface to black. Usually used for steel metal tools and mechanical parts marking. Black marking is also suitable for the visual identification of iron, stainless steel and silicon wafers.

 

4 melt marking. Melt marking is in a molten material on the surface, for example, in silicon wafer manufacturing process without dust, only the molten material surface without damage, thus marking must control the dust generated by the laser. It is usually used for the laser marking of the silicon wafers with the frequency Nd:YAG laser (532nm).